Official summary
Bill No.: <billno> Drafter: <drafterinit>
Bill No.:
HB0002
Drafter:
DRN
LSO No.:
14LSO-0168
Effective Date:
7/1/2014
Enrolled Act No.:
HEA0001
Chapter No.:
CH0015
Prime Sponsor:
Joint Education Interim Committee
Catch Title:
Bonded indebtedness mill levy supplement.
Subject:
Repealing the bonded indebtedness mill levy
supplement.
Summary/Major
Elements:
The act
eliminates the bonded indebtedness mill levy
supplement and capital leasing grant programs for school capital construction.
All
bonds issued under this provision are fully executed and this was a remnant of
the previous financing scheme for school capital construction.