Eliminating School Bond Levy Supplement
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Bill No.: <billno> Drafter: <drafterinit> Bill No.: HB0002 Drafter: DRN LSO No.: 14LSO-0168 Effective Date: 7/1/2014 Enrolled Act No.: HEA0001 Chapter No.: CH0015 Prime Sponsor: Joint Education Interim Committee Catch Title: Bonded indebtedness mill levy supplement. Subject: Repealing the bonded indebtedness mill levy supplement. Summary/Major Elements: The act eliminates the bonded indebtedness mill levy supplement and capital leasing grant programs for school capital construction. All bonds issued under this provision are fully executed and this was a remnant of the previous financing scheme for school capital construction.
Public statements
Last checked Aug 7, 12:32 PM
H05
Why they voted this way
The speaker states that the bond of indebtedness program is no longer needed because the state has assumed responsibility for constructing schools under a new regime, and therefore requests favorable consideration to clean up the statutes.
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